Soldering apparatus



Jan. 12 1926. 1,569,746

' J. H. HANKEY SOLDERING APPARATUS Filed sept. 15, 1924 Patented Jan.'12, 1926.

UNITED s ArEs' PATENT arms.

JOHN H. HANKEY ,OF HAGERSTOVTN, MARYLAND, ASSIGNOR TO THE W. H.REISNEIR, 1

MFG. COMPANY, OF HAGEBSTOWN, MARYLAND, A CORPORATION OF MARYLAND. 3

SOLDERING APPARATUS.

Application filed September15, 1924.. fierial No. 737,852.

To all whom it may concern.-

Be it known that I, JOHN H. HANKEY, a

citizen of the United States, residing at Hagerstown, in the county ofWashington and State of Maryland, have invented a certain new anduseful, Improvement in a (of joints between two or more metallic fmembers.

stand which may be readily mounted-Kin a position convenient to anoperator to rowide a continuous supply of molten fso der and solderingflux for the joining of two or more metallic members by a simple proc-'ess' of dipping. I J

' Still another object ofmy invention is to )rovide a solderin a aratushavin a solder fountain arranged adjacent a heating element in suchmanner as to continuously supply molten solder at a point convenientmembers by a process of di ing the members into a supply ofthe so er. Te

, providea construction of electrical heating element in a solderinghead for maintaining the supply of solder in a molten state, thesolderin'g'head being arranged inthe form of a differential balancingcolumn whereby a substantially semi-spherical mass of molten solderprotruding upwardly from the extremity of the column may be at all timespresented as a fountain into which the metallic members to be solderedmay be dipped.

My invention further resides in the construction and arrangement ofparts of a flux fountain and a solder fountain supported" ing apparatusofv my invention; Fig. 2xis a supplying a continuous mass of moltensol-- der in the form of a semi-spherical body into whichmetallicmembers to be soldered may be dipped. I 1 "j Other and further objectsof'm y invention will be understood from the specification hereinafterfollowing by reference to .fthe

' accompanying drawings, wherein:'

Figurel is a side elevation of the solder-.

plan 1 View of the soldering apparatus; Fig. sis a View of-the fluxreservoirpartially'in secti n; Fig. 4: isacross-secti'onal viewftaken' 1through the diiferentlal balanclng column, of the solder fountainshowing the arrange ment of the electrical heating elem'ent'adjacentthereto; and Fig. 5 shows a'modified construction of solder fountain andits asso ciated electrical he'ating'element; r My inventionfindsparticular application" v y inthe joining of wiresiofelectromagnets to Another object of my invention is topro videasoldering apparatus in the form. of a form a continuouselectricalcircuit between has required a relatively' -large. amount- "oftimeonthe part of askilled mechanic." It

has been enerally necessaryto use a hand -"soldering*1ron brought tothedesired solder- 7 ing temperature, and the parts to be soldered havebeen first cleaned by applying a flux thereto, generally bywipingtheffiux overthe parts =by means of a 'sma llsti'cklor =other handtool. I The parts have had to be to an operator for thegsoldering ofmetallic tinned byhand processes of wiping the-hand iron over-the partsand "then the hand (iron has had'to 'bemove'd over the parts to com Afurther object of my invention visto-j plete t he psoldering processrlihis method "has required a certain degree of skill'on'the part of amechanic and requiresan und'e 'sirablelarge period of timeto completethe 3 operation. With these and other disadvantages of prior methods inmind I ha'ye; developed the soldering apparatus herem describedwhichihasbeen found to be efficient 100 in use and practical in,construction. I provide a stand on which 1s mounted flux fountain and asolder founta1n. Flux may be applied tothe" ends of a pair"of"twistedwires by dipping-the wires in the-flux foun- 1 05 tain. The solder;fountain is arrranged adjacent the fluxr fountain andfis constructed. inthe form of a differential balanclng col-. umn which is conductivelyheated" by electrical means whereby a continuous: supply l lo balancingcolumn when it becomes heated tends to flow down the long column and upthe short column to seek a position substanhered to the members to forma mechanically tight joint and a resistivity.

In the soldering operation which iscapable of being performed with theapparatus of my invention it will be seen that un-' skilled labor mayreadily become familiar with the process of dipping the ends of membersto be joined in the flux fountain aperture 30 and then in the moltenmass of solder 19 in the sold-er fountain. When the members arewithdrawn from the solder fountain the solder adheres to form anextremely neat junction. Solder may be re newed from time to time in theinlet 16 and it is possible to shut down or re-energize the apparatusfrom time to time by merely cutting off or turning on the electricalcurrent supply to the heating coils.

lWhile I have described my invention in certain particularly embodimentsI desire that it be understood that modifications may be made and thatno limitations upon the invention are intended other than those imposedby the scope of the appended claims.

Vhat I claim and desire to secure by Letters Patent of the United Statesis as follows:

junction of low electrical ,1. Soldering apparatus comprising incomtain, said solder fountain consisting of a pair of balancing columnsdisposed at'an angle one with respect to the other, one of said columnsbeing substantially longer than the other and having a solder inlet portat one end thereof, and a soldering tip carried on the extremity of theother of said columns substantially in line with said solder inlet port,and means for conductively heating solder contained in said longercolumn.

3. Soldering apparatus comprising in T combination a solder fountain anda flux fountain, said solder fountain consisting of a pair of balancingcolumns disposed substantially at an angle one with respect to theother, one of said columns being longer than the other of said columnsand having a solder inlet port at the upper extremity thereof, the otherof said columns being a solder tip therein, means disposed'parallel withsaid longer column for conductively heating solder contained thereinwhereby counterbored at its extremity and carrying molten solder may beflowed over said solder tip. p

4. Soldering apparatus comprising in combination a solder fountain andaflux foun tain, sald solder fountain consisting of a pair of balancingcolumns and a solder tip, said balancing columns being disposedsubstantially at an angle one with respect to the other, with one ofsaid columns longer than the other of said columns, said solder tipdisposed at an angle to the other of said columns, meansfor conductivelyheating the longer of said columns whereby molten solder may be flowedthrough said bal-. ancing columns and over said solder tip.-

5. Soldering apparatus comprising in combination a solder fountain and aflux fountain, said solder fountain consisting of a pair of balancingcolumns and a solder tip, said balancing columns-being disposedsubstantially at right angles one with respect to the other and one ofsaid columns being substantially longer than the other of said columns,said solder tip being disposed substantially at an obtuse angle withrespect to the other of said columns, and means for conductively heatingsaid longer column whereby molten solder may be flowed through saidvcolumns and over said solder tip. c

6. A solder fountain comprising a body member, a pair of balancingcolumns carried 'at one end of said body member, a solder inlet port atthe extremity of, one of said columns, and a solder tip, constructed ofmaterial to which solder will. not adhere,

carried at the extremity of the other of said columns, means carriedinanother portion of said body member for conductively heating soldercontained in said columns Where-' by molten solder may be flowed throughsaid columns and over said solder tip in the form of a substantiallysemi-sphericalmass.

JOHN HQHANKEY. 1

